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MOTOROLA The RF Line
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc.
Order this document by MMG1001R2/D
Gallium Arsenide CATV Integrated Amplifier Module
Features
* * * * * * Specified for 79 - , 112 - and 132 - Channel Loading Excellent Distortion Performance Built - in Input Diode Protection GaAs FET Transistor Technology Unconditionally Stable Under All Load Conditions In Tape and Reel. R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel.
MMG1001R2
870 MHz 19 dB GAIN 132 - CHANNEL CATV INTEGRATED AMPLIFIER MODULE
Applications
Freescale Semiconductor, Inc...
* CATV Systems Operating in the 40 to 870 MHz Frequency Range * Input Stage Amplifier in Optical Nodes, Line Extenders and Trunk Distribution Amplifiers for CATV Systems * Output Stage Amplifier on Applications Requiring Low Power Dissipation and High Output Performance * Driver Amplifier in Linear General Purpose Applications
16 1
Description
* 24 Vdc Supply or 12 Vdc Supply with Bias Change, 40 to 870 MHz, CATV Integrated Forward Amplifier Module
CASE 978 - 03 PFP - 16
MAXIMUM RATINGS
Rating RF Voltage Input (Single Tone) DC Supply Voltage 24 V Application 12 V Application Operating Case Temperature Range Storage Temperature Range Pin 3 Q1 Pin 4 RS1 Pin 5 RS2 Pin 6 Q2 Pin 7 Q4 Pin 11 RG4 Pin 13 RG3 N.C. N.C. VG1 VS1 VC VS2 VG2 N.C. 1 2 3 4 5 6 7 8 (Top View) 16 15 14 13 12 11 10 9 N.C. VD3 N.C. VGC N.C. VD4 N.C. N.C. Pin 15 Symbol Vin VCC Value +65 +26 +14 - 20 to +100 - 40 to +100 C C Unit dBmV Vdc
TC Tstg Q3
PIN CONNECTIONS
Functional Diagram NOTE: MMG1001R2 Moisture Sensitivity Level (MSL) = 3.
REV 3
MOTOROLA RF Motorola, Inc. 2004 DEVICE DATA
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MMG1001R2 1
Freescale Semiconductor, Inc.
ESD PROTECTION CHARACTERISTICS
Test Conditions Human Body Model Machine Model Charge Device Model Class 1 (minimum) M1 (minimum) C5 (minimum)
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Symbol RJC Max 6.6 Unit C/W
ELECTRICAL CHARACTERISTICS FOR 24 V APPLICATION (VCC = 24 Vdc, TC = +30C, 75 system unless otherwise noted)
Characteristic Frequency Range Power Gain 50 MHz 870 MHz 40 - 870 MHz Symbol BW Gp S GF IRL f = 40 - 160 MHz f = 161 - 450 MHz f = 451 - 870 MHz ORL f = 40 - 400 MHz f = 401 - 870 MHz 132 - Channel FLAT 112 - Channel FLAT 79 - Channel FLAT 132 - Channel FLAT 112 - Channel FLAT 79 - Channel FLAT 132 - Channel FLAT 112 - Channel FLAT 79 - Channel FLAT 50 MHz 870 MHz CSO132 CSO112 CSO79 XMD132 XMD112 XMD79 CTB132 CTB112 CTB79 NF IDC -- -- -- -- -- -- -- -- -- -- -- -- -- 230 22 17 - 65 - 65 - 71 - 64 - 63 - 62 - 63 - 64 - 65 4 4 250 -- -- dBc - 58 - 59 - 62 dBc - 52 - 52 - 52 dBc - 56 - 56 - 58 5.0 5.0 265 dB mA (continued) -- -- 21 19 22 -- -- -- dB Min 40 -- -- -- -- Typ -- 18 19 0.6 0.5 Max 870 -- -- -- -- Unit MHz dB dB dB dB
Freescale Semiconductor, Inc...
Slope
Gain Flatness (40 - 870 MHz, Peak to Valley) Input Return Loss (Zo = 75 Ohms)
Output Return Loss (Zo = 75 Ohms)
Composite Second Order (Vout = +44 dBmV/ch., Worst Case) (Vout = +46 dBmV/ch., Worst Case) (Vout = +48 dBmV/ch., Worst Case) Cross Modulation Distortion @ Ch 2 (Vout = +44 dBmV/ch., FM = 55 MHz) (Vout = +46 dBmV/ch., FM = 55 MHz) (Vout = +48 dBmV/ch., FM = 55 MHz) Composite Triple Beat (Vout = +44 dBmV/ch., Worst Case) (Vout = +46 dBmV/ch., Worst Case) (Vout = +48 dBmV/ch., Worst Case) Noise Figure
DC Current (VDC = 24 V, TC = - 20 to +100C)
MMG1001R2 2
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MOTOROLA RF DEVICE DATA
Freescale Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS FOR 12 V APPLICATION (VCC = 12 Vdc, TC = +30C, 75 system unless otherwise noted)
Characteristic Frequency Range Power Gain Slope 50 MHz 870 MHz 40 - 870 MHz Symbol BW Gp S GF IRL f = 40 - 160 MHz f = 161 - 450 MHz f = 451 - 870 MHz ORL f = 40 - 400 MHz f = 401 - 750 MHz f = 751 - 870 MHz 112 - Channel FLAT 79 - Channel FLAT 112 - Channel FLAT 79 - Channel FLAT 112 - Channel FLAT 79 - Channel FLAT 50 MHz 870 MHz CSO112 CSO79 XMD112 XMD79 CTB112 CTB79 NF IDC -- -- -- -- -- -- -- -- -- -- -- 190 19 17 15 - 65 - 71 - 63 - 62 - 64 - 65 4 4 210 -- -- -- dBc -- -- dBc -- -- dBc -- -- 5.0 5.0 225 dB mA -- -- 21 19 19 -- -- -- dB Min 40 -- -- -- -- Typ -- 18 19 0.6 0.5 Max 870 -- -- -- -- Unit MHz dB dB dB dB
Gain Flatness (40 - 870 MHz, Peak to Valley) Input Return Loss (Zo = 75 Ohms)
Output Return Loss (Zo = 75 Ohms)
Freescale Semiconductor, Inc...
Composite Second Order (Vout = +42 dBmV/ch., Worst Case) (Vout = +42 dBmV/ch., Worst Case) Cross Modulation Distortion @ Ch 2 (Vout = +42 dBmV/ch., FM = 55 MHz) (Vout = +42 dBmV/ch., FM = 55 MHz) Composite Triple Beat (Vout = +42 dBmV/ch., Worst Case) (Vout = +42 dBmV/ch., Worst Case) Noise Figure
DC Current (VDC = 12 V, TC = - 20 to +100C)
MOTOROLA RF DEVICE DATA
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MMG1001R2 3
Freescale Semiconductor, Inc.
C10 C7 R9 C5 Pin 3 Pin 4 R18 Pin 5 Pin 6 R12 C6 C4 Pin 7 Pin 11 L2 Pin 13 R15 R16 VCC D3 R17 D2 C11 C9 T2 RF OUTPUT R13 Pin 15 L1
R11 C3 RF INPUT T1 C12
C1
R10
C8
R14
Freescale Semiconductor, Inc...
R1 R19 R2 D1 R3 R6 Q2 R4 C2 R5 Q1 R8 R7
Figure 1. MMG1001R2 50 - 870 MHz Test Circuit Schematic
Table 1. MMG1001R2 50 - 870 MHz Test Circuit Component Designations and Values
Designation C1, C7, C8, C11 C2, C3, C4, C9, C10 C5, C6 C12 D1 D2 D3 L1, L2 Q1, Q2 R1 R2 R3 R4 R5 R6 R7 R8 R9, R10, R15 R11, R12 R13, R14 R16 R17 R18 R19 T1 T2 PCB Description (24 V Application) 220 pF Chip Capacitors (0603) 0.01 mF Chip Capacitors (0603) 1.8 pF Chip Capacitors (0603) 5.6 pF Chip Capacitor (0603) 5.1 V Zener Diode, On/MM3Z5V1T1 27 V Zener Diode, On/MM3Z27VT1 Transient Voltage Suppressor, On/1.5k27A/1.5SMC27AT3 22 nH Chip Inductors (0603) Dual Transistors Package, On/MBT3904DW1T1 2.2 kW, 1/4 W Chip Resistor (1206) 560 W Chip Resistor (0603) 82 W Chip Resistor (0603) 820 W Chip Resistors (0603) 820 W Chip Resistors (0603) 120 W Chip Resistor (0603) 1.5 kW Chip Resistor (0603) 12 W, 1 W Chip Resistor (2512) 470 W Chip Resistors (0603) 18 W Chip Resistors (0603) 910 W Chip Resistors (0603) 2 kW Chip Resistor (0603) 6.2 kW Chip Resistor (0603) 15 W Chip Resistor (0603) 0 W Chip Resistor (0603) Input Transformer, Mot/77PC016E068 Output Transformer, Mot/77PC016E061 FR4, 62 mil, r = 4.81 Description (12 V Application) 220 pF Chip Capacitors (0603) 0.01 mF Chip Capacitors (0603) 1.8 pF Chip Capacitors (0603) 5.6 pF Chip Capacitor (0603) 5.1 V Zener Diode, On/MM3Z5V1T1 27 V Zener Diode, On/MM3Z27VT1 Transient Voltage Suppressor, On/1.5k27A/1.5SMC27AT3 22 nH Chip Inductors (0603) Dual Transistors Package, On/MBT3904DW1T1 820 W, 1/4 W Chip Resistor (1206) 560 W Chip Resistor (0603) 40 W Chip Resistor (0603) 150 W Chip Resistors (0603) 100 W Chip Resistors (0603) 120 W Chip Resistor (0603) 1.5 kW Chip Resistor (0603) 4.8 W, 1 W Chip Resistor (2512) 470 W Chip Resistors (0603) 18 W Chip Resistors (0603) 910 W Chip Resistors (0603) 2.7 kW Chip Resistor (0603) 6.2 kW Chip Resistor (0603) 15 W Chip Resistor (0603) 0 W Chip Resistor (0603) Input Transformer, Mot/77PC016E068 Output Transformer, Mot/77PC016E061 FR4, 62 mil, r = 4.81
MMG1001R2 4
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MOTOROLA RF DEVICE DATA
Freescale Semiconductor, Inc.
MMG1001R2 Rev 0
R5 R7 Q1
R16 R19 R9 R11 C3 C5 T1 R18 C6 C4 R10 R12 C12 C8 R14 R17 C10 R3 R2 R4 D1 D3 R1 C7 R13 L1 C9 R15 L2 T2
Freescale Semiconductor, Inc...
Q2 R6
R8 C2 C1
D2 C11
GND
Not Active
VCC
Note: 24 V Application, VCC = 24 V 12 V Application, VCC = 12 V
Figure 2. MMG1001R2 50 - 870 MHz Test Circuit Component Layout
MOTOROLA RF DEVICE DATA
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MMG1001R2 5
Freescale Semiconductor, Inc.
TYPICAL CHARACTERISTICS FOR 24 V APPLICATION
-60 CTB, COMPOSITE TRIPLE BEAT (dBc)
48 dBmV 46 dBmV -65 50 dBmV
-70
44 dBmV 42 dBmV
-75 0
79-Channel Loading, Flat 200 400 600
f, FREQUENCY (MHz)
Freescale Semiconductor, Inc...
Figure 3. Composite Triple Beat versus Frequency
-65 CSO, COMPOSITE SECOND ORDER (dBc) 48 dBmV 50 dBmV -70 46 dBmV
-75 42 dBmV -80 44 dBmV 79-Channel Loading, Flat 0 200 400 600
-85
f, FREQUENCY (MHz)
Figure 4. Composite Second Order versus Frequency
XMD, CROSS MODULATION DISTORTION (dBc)
-55 48 dBmV 50 dBmV -60 46 dBmV -65 44 dBmV -70 42 dBmV
-75 0
79-Channel Loading, Flat 200 400 600
f, FREQUENCY (MHz)
Figure 5. Cross Modulation Distortion versus Frequency
MMG1001R2 6
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MOTOROLA RF DEVICE DATA
Freescale Semiconductor, Inc.
NOTES
Freescale Semiconductor, Inc...
MOTOROLA RF DEVICE DATA
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MMG1001R2 7
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
h X 45 _
A E2
1 16 NOTES: 1. CONTROLLING DIMENSION: MILLIMETER. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 PER SIDE. DIMENSIONS D AND E1 DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 5. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION IS 0.127 TOTAL IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-. DIM A A1 A2 D D1 E E1 E2 L L1 b b1 c c1 e h q aaa bbb ccc MILLIMETERS MIN MAX 2.000 2.300 0.025 0.100 1.950 2.100 6.950 7.100 4.372 5.180 8.850 9.150 6.950 7.100 4.372 5.180 0.466 0.720 0.250 BSC 0.300 0.432 0.300 0.375 0.180 0.279 0.180 0.230 0.800 BSC --- 0.600 0_ 7_ 0.200 0.200 0.100
14 x e
D e/2
D1
8
9
E1
8X
B
BOTTOM VIEW
E CB
S
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M
Freescale Semiconductor, Inc...
b1 c
DATUM PLANE SEATING PLANE
A A2 H
C
SECT W - W
L1
ccc C
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W W L 1.000 0.039 DETAIL Y A1
GAUGE PLANE
CASE 978 - 03 ISSUE B PFP- 16
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. E Motorola Inc. 2004 HOW TO REACH US: USA /EUROPE /LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu, Minato-ku, Tokyo 106-8573, Japan 81-3-3440-3569 ASIA /PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors
MMG1001R2 8
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MOTOROLA RF DEVICE DATA
MMG1001R2/D

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